SMT Assembly
High-speed surface-mount assembly on automated pick-and-place lines with 3D SPI, nitrogen reflow and AOI inspection on every board.
Key Features
- Fine-pitch placement down to 01005 passives and 0.35 mm pitch BGA / QFN
- Laser-cut stencils and automatic solder-paste printing
- 3D solder paste inspection (SPI) before placement
- Nitrogen reflow with KIC profiling for lead-free and leaded processes
- Automated optical inspection (AOI) after reflow
Capabilities
| Min. component | 01005 (0.4 × 0.2 mm) |
| Min. BGA pitch | 0.35 mm |
| Max. board size | 510 × 460 mm |
| Placement accuracy | ±0.025 mm |
| Solder types | Lead-free SAC305, leaded Sn63/Pb37, low-temperature |
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