HDI PCB Manufacturing
High-density interconnect boards with laser microvias, fine lines and stacked / staggered via structures for smartphones, modules and high-speed computing.
Key Features
- 1+N+1, 2+N+2, 3+N+3 and any-layer HDI stack-ups
- Laser-drilled microvias from 0.10 mm
- Via-in-pad with copper filling
- Fine line 2.5 / 2.5 mil
- Low-loss materials for high-speed signals
Capabilities
| Stack-ups | 1+N+1 to any-layer |
| Microvia | 0.10 mm laser |
| Min. trace/space | 2.5 / 2.5 mil |
| Via filling | Copper filled, resin plugged |
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