Flexible PCB (FPC) Manufacturing
Polyimide flexible circuits for wearables, cameras, displays and any product that must bend, fold or fit a tight space.
Key Features
- Single, double-sided and multilayer flex
- Polyimide base with adhesive-less options
- Stiffeners (PI, FR-4, stainless steel) and EMI shielding film
- Dynamic-flex designs for repeated bending
- ENIG and immersion tin surface finishes
Capabilities
| Layers | 1 – 8 |
| Base material | Polyimide 12.5 / 25 / 50 µm |
| Min. trace/space | 2 / 2 mil |
| Coverlay | Polyimide, LPI solder mask |
| Stiffeners | PI, FR-4, stainless steel |
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